Quantum Computing Chip Design Lead
1 month ago
Oxford Ionics is a pioneering quantum computing company at the forefront of delivering world-leading innovation.
The future is quantum, and our team is pushing the boundaries of what's possible with trapped-ion technology.
We're building the world's highest-performing quantum computers to revolutionize society's ability to solve era-defining challenges. Our technology stack includes custom compilers, embedded firmware, mixed-signal and RF electronics, cryogenics, vacuum systems, lasers, chip design, and more.
As the Quantum Computing Chip Design Lead, you will be responsible for leading the team that designs, produces, and tests Quantum Processing Units (QPUs): the Quantum Processor Engineering (QPE) team. We're looking for a semiconductor chip generalist who is comfortable leading a team working across the full range of physical design, fabrication, packaging, test, and characterization.
You'll be the technical lead for the QPE team, which currently has 8 staff members, and is expected to grow to 12 staff over the next 12 months. You'll work with other team leads across the technology stack and executive management to set technical direction for the QPE team, ensuring the QPUs meet quality levels and address company needs.
The QPE team's responsibilities include:
- Development of custom semiconductor processes, including 3D electrostatic design, integrated photonics, integrated RF antennas, and the impact of cryogenic temperatures
- Rapid production of devices in prototype quantities, both in-house fabrication facilities and with industrial partners
- Rapid-turn packaging of the quantum processor devices in prototype quantities to account for critical thermal management
- Low-volume manufacturing test and characterization of non-quantum parameters of the devices
With over 10 years of experience in the microelectronics or photonics industry, you'll have a strong track record of bringing devices from design through prototyping or early-stage production. Demonstrated technical leadership in microfabrication, microelectronics, integrated photonics, or packaging is essential. Excellent communication skills are required, along with the ability to navigate uncertainty and respond to fast-changing product requirements.
Ideally, you'll have expertise across multiple aspects of chip development, such as analog/digital design, multiphysics simulations, fabrication process development, advanced packaging, and device testing. Familiarity with chip fabrication and packaging processes will strengthen your fit for this role.
We offer a competitive salary of £120,000 per annum, plus business stock options, uncapped annual leave, flexible working, private medical and dental insurance, and more.
Oxford Ionics is committed to equal opportunity for all.
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