Packaging Solutions Specialist

6 days ago


Oxford, Oxfordshire, United Kingdom IC Resources Full time
Job Overview

IC Resources is seeking a highly skilled Packaging Engineer to join our team in the photonics operations department. The successful candidate will work closely with engineering and product development teams to specify and develop packaging solutions for volume manufacture.

Key Responsibilities:

  • Collaborate with cross-functional teams to design and implement packaging solutions that meet customer requirements.
  • Work with vendors to select and qualify assembly processes, ensuring high-quality and reliable products.
  • Coordinate day-to-day management of external vendors, ensuring timely delivery and effective communication.
  • Develop and maintain expertise in assembly packaging techniques, including dicing, die attach, flip chip, wire bonding, and other relevant processes.
  • Stay up-to-date with the latest advancements in semiconductor device manufacturing, high-volume testing, and packaging.
  • Contribute to the development of photonics packaging solutions, leveraging expertise in this area.
  • Communicate effectively with internal stakeholders, vendors, and customers to ensure seamless project execution.

Requirements:

  • Master's degree in a relevant technical field, such as engineering or physics.
  • Proven experience in assembly packaging techniques, semiconductor device manufacturing, and high-volume testing.
  • Strong communication and interpersonal skills, with the ability to work effectively in a team environment.
  • Ability to adapt to changing priorities and deadlines, with a focus on delivering high-quality results.


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