Packaging Engineer for Photonics Operations
2 weeks ago
We are seeking a skilled Packaging Engineer to collaborate with our engineering and product development teams at IC Resources. The successful candidate will be responsible for specifying packaging solutions for volume manufacture, working with vendors to select and qualify assembly processes, and coordinating day-to-day management of external vendors.
Key qualifications for this role include:
- Experience with assembly packaging techniques, including dicing, die attach, flip chip, wire bonding, and other relevant processes.
- Knowledge of semiconductor device manufacturing steps, high-volume testing, and packaging, as well as product development.
- Desirable skills include photonics packaging experience and strong communication skills.
- A Master's degree in a relevant technical field is required.
For more information, please contact IC Resources.
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