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Packaging Solutions Specialist

2 months ago

Oxford, Oxfordshire, United Kingdom IC Resources Full time
Job Overview

IC Resources is seeking a highly skilled Packaging Engineer to collaborate with our photonics operations team. The successful candidate will work closely with engineering and product development teams to specify and implement packaging solutions for volume manufacture.

Key Responsibilities:

  • Develop and implement assembly packaging techniques, including dicing, die attach, flip chip, and wire bonding
  • Collaborate with vendors to select and qualify assembly processes
  • Coordinate day-to-day management of external vendors
  • Ensure compliance with semiconductor device manufacturing steps and high-volume testing and packaging

Requirements:

  • Master's degree in a relevant technical field
  • Strong communication skills
  • Experience with assembly packaging techniques and semiconductor device manufacturing
  • Photonics packaging experience is a plus

Why IC Resources?

We offer a dynamic and challenging work environment that fosters growth and development. If you are a motivated and experienced Packaging Engineer looking for a new opportunity, please contact us for further details.