Hybrid Microelectronics Packaging Engineer
2 days ago
About the Role:
We are looking for a highly skilled Hybrid Microelectronics Packaging Engineer to join our team at Redline Group Ltd. As a key member of our engineering team, you will play a critical role in delivering solutions to material and integration challenges aligned with optoelectronic assemblies/hybrid microelectronics packaging.
The ideal candidate will have a strong background in optoelectronic assemblies/devices and a good understanding of product development from NPI through to manufacture. You will be responsible for developing expertise in optoelectronic materials and manufacturing processes, working closely with design and manufacturing departments as well as externally with customers on multi-channel optical communications.
Key Responsibilities:
- Design and develop innovative solutions for optoelectronic assembly and hybrid microelectronics packaging challenges
- Liaise with design and manufacturing teams to ensure seamless product development from NPI through to manufacture
- Collaborate with external customers to meet their needs in multi-channel optical communications
Requirements:
- Bachelor's degree in Electronics Engineering or related field
- Proven experience in optoelectronic assembly and hybrid microelectronics packaging
- Excellent communication and problem-solving skills
- Able to obtain Security Clearance
What We Offer:
- Competitive salary of £60,000 - £80,000 per annum (dependent on experience)
- Ongoing professional development opportunities
- Flexible working arrangements, including hybrid work model
- Relocation assistance up to £8,000
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