Senior Principal RF Manager

17 hours ago

Paignton, Torbay, United Kingdom Oriole Networks Full time

We're seeking a Senior Principal RF Manager to lead high-speed signal/RF interface design and verification for next-generation optical network platforms. You'll own end-to-end RF architecture, compliance to OIF CEI specifications, simulation and modelling workflows (HFSS, S-parameter/IBIS), and partner/supplier technical engagement. This role blends hands-on technical leadership with strategic direction—ideal for someone who drives decisions through rigorous design, system-level thinking, and iterative, agile development practices. You will also champion innovation across teams, introducing new methodologies, tools, and design approaches that elevate performance and accelerate time-to-market. 

Key Responsibilities:

RF Architecture, Design & Verification 

  • Own the highspeed signal/RF interface design and verification across product lifecycle (concept → bringup → validation) using ambitious design to refine architecture and converge quickly on design decisions. 

  • Ensure compliance with OIF Common Electrical Interface (CEI) specs and related standards across lanes and link budgets for modules and interface cards. 

  • Lead HFSS-based simulations, including transmission lines, transitions (vias, connectors), couplers, launch structures, and RF components. 

  • Develop and refine stack-up, routing, impedance targets, and de-embedding approaches for high density boards. 

  • Define measurement plans and tolerance analyses to validate against spec and environmental/aging conditions. 

    Modelling, Data & System Integration 

  • Collate and provide modelling inputs for optical network/system teams: generate/curate highquality Sparameter (S4P) files and IBIS/IBISAMI models with proper documentation, corners, and validation checks. 

  • Promote innovative modelling automation and data-driven workflows that improve accuracy, repeatability, and productivity. 

    Test Structures & Evaluation 

  • Design and evaluate test structures to support product decisions and derisk manufacturing. 

  • Create DOE plans, acceptance criteria, and analysis templates to accelerate iteration and convergence. 

  • Apply agile experimentation principles—rapid prototyping, short feedback loops, and adaptive test planning. 

    Supplier & Partner Engagement 

  • Lead supplier engagement for PCB materials (e.g., lowloss laminates), fabrication technologies (HDI, backdrilling, via-in-pad), and component selection (connectors, passives, RF components).

  • Act as the technical interface to 3rdparty development partners on RF requirements, verification methodologies, and deliverables. 

  • Introduce innovative approaches to supplier collaboration, enabling early risk visibility and accelerated co-development. 

    Team Collaboration & ElectroMechanical Integration 

  • Collaborate with mechanical, packaging, optics, and firmware teams to cooptimize electromechanical designs (thermal relief, keepouts, connector placement, EMI/EMC mitigations). 

  • Contribute to DFM/DFT practices and testability of RF paths. 
    Leadership & Governance 

  • Provide technical mentoring to one to three direct report and broader team members. 

  • Establish engineering standards, checklists, and review gates for RF design and verification. 

  • Report against deliverables and provide mitigation strategies.  

  • Own risk registers, mitigation plans, and clear communication of trade-offs to stakeholders. 

Required Qualifications & Experience:

  • 10–15+ years in RF/highspeed digital design (SerDes, PAM4/NRZ, up to 56–224G lanes) with a delivery track record. 

  • Deep expertise in electromagnetic simulation (HFSS) for transmission lines, launch/transition optimization, and component modelling. 

  • Strong knowledge of OIFCEI electrical specs and compliance methodologies. 

  • Proficiency with Sparameter generation/processing (S4P), IBIS/IBISAMI, and model correlation to lab results. 

  • Hands-on experience with VNA, TDR, highbandwidth scopes, and fixture/deembedding techniques (TRL/SOLT, time gating). 

  • Experience collaborating with PCB fabricators on materials (e.g., Megtron, Tachyon, I-Speed), stack-ups, via strategies, and manufacturing constraints. 

  • Excellent communication skills for crossfunctional leadership and partner engagement. 

  • Exposure to optical transceiver modules (QSFPDD/OSFP, Copackaged Optics) and backplane/interconnect design. 

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