Hardware Platform Architect

About UsTessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up and spec to product. With 3200+ employees worldwide, Tessolve delivers a one-stop solution with advanced silicon and system testing labs.We offerTurnkey ASIC Solutionsfrom design to packaged parts, leveraging strong ecosystem partnerships with EDA, IP, and foundry vendors. Our integrated front-end and backend expertise reduces design risks and accelerates time-to-market.OurR&D centers of excellencefocus on emerging technologies such as 5G, mmWave, Silicon Photonics, HSIO, HBM/HPI, and System-Level Test. Tessolve also deliversend-to-end embedded product design servicesunder an ODM model for Avionics, Automotive, Industrial, and Medical applications.Tessolve's clientele includes9 of the top 10 semiconductor companies, along with Tier-1 clients, start-ups, and government entities. We have aglobal presence in 12+ countries, with advancedtest labs in India, Singapore, Malaysia, Austin, and San Jose.For more details, visitRole:Experienced (>10y) Hardware Platform Architect to support Arm's Hardware Platform team. You will work with the SoC teams, architects and platform leads to help define, influence, align and agree technical requirements and features for implementation. Assess design trade-offs to develop the most optimal solution for our customers and development partners.Responsibilities:Engage with technical leads, product managers and SoC development teams to translate technical requirements into platform architecture specifications addressing the embedded compute and infrastructure or server market segmentsEvaluate architecture proposals and features and coordinate across Silicon Architects, hardware, software and platforms to align all parties to a common visionLiaise with board hardware designers to drive specifications into implementation for schematic and PCB aligning with Packaging SI and PI Engineers.Communicate technical concepts clearly and credibly across audiences ranging from individual hardware and software engineers to architects and technology leadsQualifications:Deep technical background and solid understanding of SoC architectures, memory interfaces and platforms involving embedded compute, AI or related fieldsExperience with high-speed interface standards (PCIe Gen5/6, LPDDR5/6) and peripherals for embedded computeCompetence with embedded system board design, designing with complex LSI devices such as FPGAs and embedded firmware and power management ICsExperience of EDA tools for schematic entry, PCB layout from a board-design perspective (Cadence OrCAD CIS, Allegro PCB suite)Strong knowledge of PCB stack-up definition, controlled impedance routing guidelines for complex stack-ups and topologiesExcellent communication and interpersonal skills with the ability to coordinate and influential across multiple teams and geographiesAbility to drive progress in an ambiguous environment with evolving needsWhy TessolveJoin a global semiconductor solutions leader, where you'll work oncutting-edge packaging designprojects across advanced technologies, collaborate withworld-class engineering teams, and help shape the future of semiconductor innovation.Equal Opportunity EmployerTessolve is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employmentwithout regard to race, color, religion, gender, sexual orientation, national origin, age, disability, veteran status, or any other protected characteristic.