Process Engineer

4 days ago

Newport, United Kingdom Catapult Full time

Reporting to the Engineering Manager, the Packaging Process Engineer will work in a challenging R&D environment to explore and develop disruptive packaging and integration technologies to make next-generation systems more energy and packaging efficient.The Process Engineer will work with a team of multidisciplinary engineers to develop novel semiconductor chip assembly and integration processes for advanced packaging of compound semiconductor-based devices, modules and systems.They will apply their knowledge to solve the assembly and bonding challenges in the advanced packaging of compound semiconductor products using a wide range of die and wire bonding materials. Key responsibilities include:Participate in the Semiconductor packaging, assembly process development, prototyping, and bill of materials (BOM) strategies for single die, multi-die or system in package (SIP) packaging solutions for power electronics/ RF/ PhotonicsProvide package design inputs, material selection and assembly process development for a number of different semiconductor packagesFollow the semiconductor/ micro-electronic package process flow, material set, test vehicle, DOEs, process control plans to successfully develop manufacturable and reliable packaging processes such as Die attach technologies, Flip-Chip, hybrid bonding, Wire bond, SIP (System in Package)R&D of assembly interconnects and interfacesSemiconductor package prototyping, testing, reliability & failure analysisDevelop semiconductor assembly process of interpreting reports derived from design of experiments (DOEs) and ensure all potential obstacles are identified and provide mitigation plans for identified issuesWork with internal design and products teams and drive design for manufacturing (DFM) methodology for new technologiesActively research to resolve semiconductor assembly interconnect challenges through developing new integration schemes and characterisation of novel packaging architectures involving highly technical and scientific methodsStudy microelectronics assembly process, bonding materials and apply the knowledge to develop advanced interconnects for compound semiconductor device and module packagingGather customer requirements and follow procedures to build assembly process relevant to the project work.Conduct experiments to determine material properties and relate these to project workUse results from simulations and experiments to aid package designOperate key assembly equipment and undertake process and SOP developmentGenerate technical reports on results and conclusions drawn from experiments conducted and incorporate findings in formal specificationsEstimate set-up times, flow-times, costs of production and acceptance equipmentAs needed, performs support functions for project planning to achieve quality, delivery schedules, and cost objectivesWork closely with suppliers providing technical specifications and procuring components and test equipment to specification and budgetParticipate in technical risk assessments #J-18808-Ljbffr

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