Process Development Engineer for High-Volume Wafer Production
1 week ago
We are PragmatIC Semiconductor, a leading innovator in flexible electronics. Our cutting-edge technology enables the mass production of ultra-low-cost, flexible integrated circuits (ICs). With our unique solution, we aim to transform industries by making ICs accessible to everyone.
SalaryThe estimated annual salary for this position is £60,000 - £80,000 based on industry standards and market conditions.
Job DescriptionWe are seeking an experienced Process Development Engineer to join our growing team in the North East of England. As a key member of our Back End process development team, you will play a crucial role in developing high-volume processing capabilities for our wafer and die products.
- You will support the process development of back-end wafer and die processes, particularly die singulation and laser processing.
- You will contribute effectively to developing capable high-volume processing on new and existing equipment and enabling successful handover to Operations.
This is a fantastic opportunity to work with a talented team of engineers and scientists, driving innovation and growth in the flexible electronics industry.
Key Responsibilities- Develop and implement process development plans to achieve high-volume production capabilities.
- Collaborate with cross-functional teams to ensure seamless communication and effective project delivery.
- Contribute to a positive culture of Health and Safety by demonstrating and encouraging safe working practices.
- Develop a competent level of understanding of test equipment and interpret data to make informed decisions.
- Support the process development on new and existing machines.
- Assist in scoping out new equipment for high-volume processing.
- Work with suppliers to ensure delivery of suitable equipment and processes.
- Communicate results effectively and professionally.
To be successful in this role, you will need:
- A Bachelor's Degree in a relevant subject or equivalent experience in back-end semiconductor processes.
- Experience in developing back-end wafer processing, particularly die singulation and laser processing.
- Excellent communication and interpersonal skills.
- Proficiency in Microsoft packages such as Word, Excel, and PowerPoint, and experience of analytical software like JMP.
- Understanding of Statistical Process Control (SPC) and data analysis techniques.
- Highly competent reporting skills.
We offer a highly competitive benefits package, including Visa/Relocation support to the North East of England, where our state-of-the-art fab is based.
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