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Packaging Engineer

2 months ago

Oxford, Oxfordshire, United Kingdom IC Resources Full time
Job Overview

IC Resources is seeking a highly skilled Packaging Engineer to join our photonics operations team. The successful candidate will work closely with engineering and product development teams to specify and develop packaging solutions for volume manufacture.

Key Responsibilities:

  • Collaborate with cross-functional teams to design and develop packaging solutions that meet customer requirements.
  • Work with vendors to select and qualify assembly processes, ensuring high-quality and reliable packaging solutions.
  • Coordinate day-to-day management of external vendors, ensuring timely delivery and quality of packaging components.
  • Develop and maintain technical documentation, including packaging specifications and process control procedures.
  • Stay up-to-date with industry trends and advancements in packaging technologies, applying this knowledge to improve packaging solutions.

Requirements:

  • Proven experience in assembly packaging techniques, including dicing, die attach, flip chip, wire bonding, etc.
  • Strong knowledge of semiconductor device manufacturing steps and high-volume testing and packaging.
  • Desirable: experience in photonics packaging and strong communication skills.
  • Master's degree in a relevant technical field, such as engineering or materials science.