Process Integration Engineer
3 days ago
JOB AD:
Process Integration Engineer - Chip R&D/NPI department Buckingham -UK - MUST BE ABLE TO DRIVE due to location Highly competitive salary on offer plus incredible employee benefits
Join their growing R&D Chip Department responsible for production across a range of incredible products.
RESPONSIBILITIES:
- Development of new InP wafer fab processes required for novel chips for high speed optical fibre transmitter components, and ensuring these processes are manufacturable in volume.
- Improvements on existing wafer fab processes for production components, for both coherent and direct detection photonic semiconductor components.
- Integration of new wafer fab processes with existing process steps.
- Writing of procedures on wafer fab MES systems.
- Transfer into manufacture of new process steps and new chips.
- Wafer process optimisations for improved yield, cost or cycle time.
- Presentation of wafer process information to R&D and operations teams with manufacturability statistical evidence.
TO BE CONSIDERED FOR THIS POSITION YOU WILL HAVE THE FOLLOWING:
- Degree in physics, electrical/electronic engineering, materials science or a related discipline, with a broad engineering background.
- In-depth knowledge of semiconductor wafer processing techniques
- Experience in a broad range of semiconductor wafer processing, including but not restricted to several of the following: lithography, dry etching, wet etching, dielectrics/metal deposition patterning, implant, diffusion.
- Process integration of existing and new wafer processes for manufacture of new designs on new wafer platforms.
- Knowledge of important aspects of semiconductor materials.
- Proven ability to execute complex engineering activities
- Project co-ordination between R&D and manufacturing teams
- Previous experience in this or related industries (optoelectronics, semiconductor technology, solid state physics, electronics or telecommunications) is not essential, but is advantageous
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