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Principal Packaging Architect

2 months ago

Edinburgh, United Kingdom Isaac Gracie Full time

Our American owned start up company based in Edinburgh is on the lookout for an experienced Principal Packaging Architect to lead and innovate in the field of semiconductor packaging design and development. In this pivotal role, you will spearhead the packaging strategy for state-of-the-art semiconductor products, work in tandem with cross-functional teams, and refine packaging solutions to ensure they are high-performing, scalable, and cost-efficient for manufacturing.
Key Responsibilities:
- Lead the architecture, design, and development of sophisticated semiconductor packaging solutions, such as 2.5D/3D IC, System-in-Package (SiP), Flip Chip, and Wafer-Level Packaging.
- Establish packaging requirements considering product performance, reliability, thermal, mechanical, and cost factors.
- Work collaboratively with chip design, process engineering, and manufacturing teams to guarantee a seamless integration of packaging technologies with semiconductor designs.
- Propel packaging technology roadmaps, aligning them with product development schedules and industry trends.
- Assess and integrate new materials, processes, and equipment for future packaging technologies.
- Offer technical guidance and mentorship to packaging engineers and interdisciplinary teams.
- Engage with customers and suppliers to ensure that packaging solutions adhere to customer specifications and industry benchmarks.
- Remain abreast of industry progressions and evaluate their potential impact on company products.
Key Qualifications:
- Education: MS/PhD in Materials Science, Electrical Engineering, Mechanical Engineering, or a related discipline.
- Experience: Over 10 years in semiconductor packaging design, development, and manufacturing, including at least 5 years working with major OSATs (ASE, AMKOR, SpiL, etc.).
- A profound comprehension of semiconductor device physics, packaging materials, and thermal/mechanical analysis.
- Demonstrated expertise in advanced packaging technologies, including 2.5D/3D packaging, SiP, Flip Chip, and WLP.
- Familiarity with high-volume manufacturing and knowledge of the latest industry standards and practices.
The client offers the opportunity of remote, hybrid or on site working at their fantastic offices in the heart of Edinburgh Fantastic benefits package available