Senior Packaging Engineer

2 weeks ago


Oxford Oxfordshire, United Kingdom IC Resources Full time

The role will involve working with engineering and product development teams to specify required packaging solutions required for volume manufacture.
Working with vendors to select and qualify assembly processes will be required as well as coordinating day to day management of external vendors.
Experience with assembly packaging techniques including dicing, die attach, flip chip, wire bonding etc
Knowledge of semiconductor device manufacturing steps and high-volume testing and packaging and product development.
Master’s degree in a relevant technical field
The role will involve working with engineering and product development teams to specify required packaging solutions required for volume manufacture.
Working with vendors to select and qualify assembly processes will be required as well as coordinating day to day management of external vendors.
Experience with assembly packaging techniques including dicing, die attach, flip chip, wire bonding etc
Knowledge of semiconductor device manufacturing steps and high-volume testing and packaging and product development.
Master’s degree in a relevant technical field



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