IC Package Design Engineer

2 weeks ago

Glasgow, United Kingdom Technical Futures. Careers Full time

An IC Package Design Engineer with extensive hands-on experience using Cadence APD/SIP will join a thriving High Technology scale-up, enabling the build of scalable, energy efficient AI systems Worldwide.The IC Package Design Engineer will undertake all package design activities; ensuring cost effective methodologies are incorporated, completing verification of electrical characteristics of the package and providing support to Assembly related activities.The IC Package Design Engineer should possess the following skills & experience:Proven top level Package design and RLC parasitic extraction.5+ years in IC Package design using Cadence APD/SIP.Using Cadence (Virtuoso/Extract IM/Power DC) / Ansys / SQW Tools (SiWave/Q3D).Using AutoCAD tool.Knowledge of various IC Packaging technology.Electronic Engineering related Degree qualification.A basic understanding of Thermal and mechanical behaviour of IC Packages.This exciting Semiconductor Company will offer a highly competitive salary package to the successful IC Package Design Engineer.AMRT1_UKTJ...

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    3 weeks ago

    Glasgow, United Kingdom Technical Futures. Full time

    An IC Package Design Engineer with extensive hands-on experience using Cadence APD/SIP will join a thriving High Technology scale-up, enabling the build of scalable, energy efficient AI systems Worldwide. The IC Package Design Engineer will undertake all package design activities; ensuring cost effective methodologies are incorporated, completing...

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    4 weeks ago

    Glasgow, United Kingdom Technical Futures. Full time

    An IC Package Design Engineer with extensive hands-on experience using Cadence APD/SIP will join a thriving High Technology scale-up, enabling the build of scalable, energy efficient AI systems Worldwide. The IC Package Design Engineer will undertake all package design activities; ensuring cost effective methodologies are incorporated, completing...

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    Glasgow, United Kingdom Technical Futures. Full time

    An IC Package Design Engineer with extensive hands-on experience using Cadence APD/SIP will join a thriving High Technology scale-up, enabling the build of scalable, energy efficient AI systems Worldwide. The IC Package Design Engineer will undertake all package design activities; ensuring cost effective methodologies are incorporated, completing...

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    Glasgow, United Kingdom Technical Futures. Full time

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    1 week ago

    Glasgow, United Kingdom Technical Futures. Full time

    An IC Package Design Engineer with extensive hands-on experience using Cadence APD/SIP will join a thriving High Technology scale-up, enabling the build of scalable, energy efficient AI systems Worldwide.The IC Package Design Engineer will undertake all package design activities; ensuring cost effective methodologies are incorporated, completing verification...

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    7 days ago

    Glasgow, United Kingdom Technical Futures. Full time

    An IC Package Design Engineer with extensive hands-on experience using Cadence APD/SIP will join a thriving High Technology scale-up, enabling the build of scalable, energy efficient AI systems Worldwide.The IC Package Design Engineer will undertake all package design activities; ensuring cost effective methodologies are incorporated, completing verification...

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    Glasgow, United Kingdom Technical Futures. Full time

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