Mirelai Project Doctorate Researcher
3 months ago
Thamesmead, Greater London, United Kingdom
University of Greenwich
Full time
Project description:
The research will focus on a new microstructure-informed reliability prediction approach for microelectronics packaging and component assembly designs based on:1) Combination of state-of-the-art metrology and failure characterization methods and physics-of-failure modelling and machine learning methods.
2) Diagnosis of the electronics assembly's current health and prognosis of how degradation will progress over time.
